| Material Type | Temperature Range (℃) | Dielectric Strength (kV/mm) | Dielectric Constant (1GHz) | Mechanical Strength (MPa) | Moisture Resistance | Cost | Application |
| PA66 | -40~105 | 18~22 | 3.8~4.2 | 70~90 | Average | Low | Consumer electronics, industrial control connector housing |
| PA66+30%GF | -40~120 | 20~25 | 4.0~4.5 | 100~130 | Average | Medium | Automotive & industrial equipment connector housing |
| PBT | -40~100 | 15~20 | 3.2~3.6 | 50~70 | Good | Low | Mid low end consumer electronics connector housing |
| LCP | -55~150+ | 25~30 | 2.8~3.2 | 80~100 | Excellent | High | High speed, high temperature, automotive connector housing |
| PA9T | -40~120 | 20~25 | 3.6~4.0 | 90~110 | Good | Medium High | Balanced temperature resistance & cost, automotive & industrial equipment |
Principles for Insulation Material Selection
1. Temperature Resistance Requirements
- · Low temperature application (≤ 40℃): Adopt materials with good low temperature toughness (PA66, LCP) to prevent brittle fracture.
- · High temperature application (≥125℃): Adopt high temperature resistant materials (LCP, PA9T, PPS). For example, LCP for automotive engine bay connectors; PPS for aerospace connectors.
1. Electrical Performance Requirements
- · High speed / RF connectors: Select materials with low dielectric constant and low dielectric loss (LCP, PPS) to minimize signal attenuation.
- · High voltage connectors: Select materials with high dielectric strength (LCP, PA66+GF) to avoid electrical breakdown.
1. Environmental Conditions Requirements
- · Humid environment (e.g. outdoor, medical equipment): Use materials with excellent moisture resistance (LCP, PBT). Avoid PA series materials whose insulation performance degrades due to water absorption.
- · Corrosive environment (e.g. chemical equipment): Select corrosion resistant materials (PPS, LCP).
1. Processing Technology Requirements
- · Housings with complex structures: Select materials with good flowability (PA).
AMASS High current connector use the PBT which can help you maintain stable connections in application scenarios such as high-intensity vibration, repeated high and low temperature impacts, small volume, and high current
Post time: Aug-11-2026